IMIC Website: http://www.imic.org
FINAL
CALL FOR PAPERS
THIRTEENTH INTERNATIONAL
CONFERENCE
ON
CHEMICAL-MECHANICAL POLISH (CMP)
PLANARIZATION
FOR ULSI MULTILEVEL INTERCONNECTION (CMP-MIC)
MARCH 3 - 6, 2008
FREMONT MARRIOTT CALIFORNIA
CMP-MIC CONFERENCE OBJECTIVES
To assemble researchers and technical support personnel from Industry, Universities and Government Laboratories from around the globe to address all current and future issues related to CHEMICAL- MECHANICAL POLISH PLANARIZATION as applied to on-chip ULSI Multilevel Interconnection and other applications.
TOPICAL AREAS
DEVELOPMENTS IN DIELECTRIC & METAL CMP PROCESSES & CONTROL
CMP IN-SITU PROCESSING & MONITORING
ELECTRO-CMP PROCESSING & MONITORING
CMP PROCESS INTEGRATION FOR DIELECTRICS & METALS
CONTAMINATION AND (PRE & POST) CLEANING ISSUES, ENVIRONMENTAL IMPACT
CMP CONSUMABLE DEVELOPMENTS (PADS/SLURRIES/ETC.)
EQUIPMENT AND MANUFACTURING ISSUES & MODELING
METROLOGY, CHARACTERIZATION, TEST; MODELING AND SIMULATION
CMP STANDARDS DEVELOPMENTS, NEW TECHNOLOGIES & PATENT INFO
ALTERNATIVE GLOBAL PLANARIZATION TECHNIQUES AS COMPARED TO CMP
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