> 最新消息 > 學術活動Call for papers: ISMI2018 + IEEE SMILE2018 Feb 7~9 @ National Tsing Hua University, Hsinchu, Taiwan

【學術活動】Call for papers: ISMI2018 + IEEE SMILE2018 Feb 7~9 @ National Tsing Hua University, Hsinchu, Taiwan

2017-10-16

     The 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI 2018) & 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (IEEE SMILE 2018) will be held February 7-9, 2018 in Hsinchu, Taiwan.

The text of the Call for Papers is included below for your consideration.

2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018)

& 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (IEEE SMILE 2018) 

Conference Chairs: Chen-Fu Chien, Jei-Zheng Wu, & Runliang Dou

February 7 - 9, 2018, Hsinchu, Taiwan

Aims and Topics:
     The joint conference of 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018) and 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE 2018) aims to disseminate recent theoretical and methodological developments, applications, and case studies in light of ongoing revolutions for manufacturing intelligence and smart manufacturing. Topics of interest include, but are not limited to, the following:

 

Big Data Analytics & Data Mining for Smart Manufacturing         Industry 4.0 & Cyber-Physical Systems

AI & Computational Intelligence for Smart Manufacturing           Advanced Process Control/ Advanced Equipment Control

Internet of Things (IOT)                                                                Virtual Metrology, Tool Health, Fault Detection & Classification

Manufacturing Intelligence, Evolutionary Algorithms                   Circular Economics, Green Supply Chain & Sustainability

Decision Technologies, Modeling & Decision Analysis               Augmented Reality, Virtual Reality

Simulation Optimization & Applications                                       Manufacturing Strategy & Manufacturing Innovation

Corporate Resource Planning & ERP                                          User Experience & Innovative Design

Smart Production Facilities & Green Fab                                    Human-machine Collaboration, Ergonomics & Safety

Predictive Maintenance, Quality & Reliability                             Total Resource Management & Overall Resource Effectiveness

Semiconductor & High-tech Manufacturing                               Applications of Industrial Engineering & Logistics

Organized/sponsored by:

NTHU-TSMC Center for Manufacturing Excellence, National Tsing Hua University

Industrial Engineering and Management Program, Ministry of Science and Technology, Taiwan

Society for Excelling Enterprises and Decisions (SEED), Taiwan

 

Paper submission:

     All papers must be written in English with a maximum length of 6 pages. Paper format, submission, and related information is updated: http://DALab.ie.nthu.edu.tw/ISMI2018/ and submission page: https://www.easychair.org/conferences/?conf=ismi2018 For more details, please consult Co-Chair, Professor Jei-Zheng Wu (jzwu@scu.edu.tw).

Special Issues for Post-Conference Publication:

Conference proceedings of full papers will be published by IEEE Xplore that is indexed by Ei Compendex. Selected papers will be recommended for reviews and possible publications in special issues of SCI journals including Journal of Intelligent Manufacturing and others as in http://DALab.ie.nthu.edu.tw/ISMI2018/

Important Dates:

Deadline for Submission of Abstract and Special Session Proposals: October 31, 2017

Deadline for Full Paper Submission for EI Indexed Proceedings for IEEE Xplore: October 31, 2017

Deadline for Full Paper/Presentation-only Abstract Submission: November 30, 2017

Camera Ready Manuscript Submission: January 5, 2018

Registration Fee:

Full registration: US$500 (Early bird, before December 10, 2017) / US$600 (Regular)

Student registration: US$350 (Early bird, before December 30, 2017) / US$400 (Regular)

Tutorial Session, Exhibit, and Factory Visiting:

This conference will provide a platform for related activities such as tutorial, exhibit, and factory visiting to enrich conference.

 

Venue: National Tsing Hua University (http://nthu-en.web.nthu.edu.tw/bin/home.php) (special offers of NTHU guest house and hotels nearby are available). 

​聯繫

專員:沈君璐小姐、魏婉鈞小姐

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