【學術活動】Call for papers: ISMI2018 + IEEE SMILE2018 Feb 7~9 @ National Tsing Hua University, Hsinchu, Taiwan
2017-10-16
The 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI 2018) & 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (IEEE SMILE 2018) will be held February 7-9, 2018 in Hsinchu, Taiwan.
The text of the Call for Papers is included below for your consideration.
2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018)
& 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (IEEE SMILE 2018)
Conference Chairs: Chen-Fu Chien, Jei-Zheng Wu, & Runliang Dou
February 7 - 9, 2018, Hsinchu, Taiwan
Aims and Topics:
The joint conference of 2018 International Symposium on Semiconductor Manufacturing Intelligence (ISMI2018) and 2018 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE 2018) aims to disseminate recent theoretical and methodological developments, applications, and case studies in light of ongoing revolutions for manufacturing intelligence and smart manufacturing. Topics of interest include, but are not limited to, the following:
Big Data Analytics & Data Mining for Smart Manufacturing Industry 4.0 & Cyber-Physical Systems
AI & Computational Intelligence for Smart Manufacturing Advanced Process Control/ Advanced Equipment Control
Internet of Things (IOT) Virtual Metrology, Tool Health, Fault Detection & Classification
Manufacturing Intelligence, Evolutionary Algorithms Circular Economics, Green Supply Chain & Sustainability
Decision Technologies, Modeling & Decision Analysis Augmented Reality, Virtual Reality
Simulation Optimization & Applications Manufacturing Strategy & Manufacturing Innovation
Corporate Resource Planning & ERP User Experience & Innovative Design
Smart Production Facilities & Green Fab Human-machine Collaboration, Ergonomics & Safety
Predictive Maintenance, Quality & Reliability Total Resource Management & Overall Resource Effectiveness
Semiconductor & High-tech Manufacturing Applications of Industrial Engineering & Logistics
Organized/sponsored by:
NTHU-TSMC Center for Manufacturing Excellence, National Tsing Hua University
Industrial Engineering and Management Program, Ministry of Science and Technology, Taiwan
Society for Excelling Enterprises and Decisions (SEED), Taiwan
Paper submission:
All papers must be written in English with a maximum length of 6 pages. Paper format, submission, and related information is updated: http://DALab.ie.nthu.edu.tw/ISMI2018/ and submission page: https://www.easychair.org/conferences/?conf=ismi2018 For more details, please consult Co-Chair, Professor Jei-Zheng Wu (jzwu@scu.edu.tw).
Special Issues for Post-Conference Publication:
Conference proceedings of full papers will be published by IEEE Xplore that is indexed by Ei Compendex. Selected papers will be recommended for reviews and possible publications in special issues of SCI journals including Journal of Intelligent Manufacturing and others as in http://DALab.ie.nthu.edu.tw/ISMI2018/
Important Dates:
Deadline for Submission of Abstract and Special Session Proposals: October 31, 2017
Deadline for Full Paper Submission for EI Indexed Proceedings for IEEE Xplore: October 31, 2017
Deadline for Full Paper/Presentation-only Abstract Submission: November 30, 2017
Camera Ready Manuscript Submission: January 5, 2018
Registration Fee:
Full registration: US$500 (Early bird, before December 10, 2017) / US$600 (Regular)
Student registration: US$350 (Early bird, before December 30, 2017) / US$400 (Regular)
Tutorial Session, Exhibit, and Factory Visiting:
This conference will provide a platform for related activities such as tutorial, exhibit, and factory visiting to enrich conference.
Venue: National Tsing Hua University (http://nthu-en.web.nthu.edu.tw/bin/home.php) (special offers of NTHU guest house and hotels nearby are available).
